JPH0212663U - - Google Patents
Info
- Publication number
- JPH0212663U JPH0212663U JP8958488U JP8958488U JPH0212663U JP H0212663 U JPH0212663 U JP H0212663U JP 8958488 U JP8958488 U JP 8958488U JP 8958488 U JP8958488 U JP 8958488U JP H0212663 U JPH0212663 U JP H0212663U
- Authority
- JP
- Japan
- Prior art keywords
- peripheral base
- flexible
- mechanical quantity
- semiconductor
- flexible portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8958488U JPH0212663U (en]) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8958488U JPH0212663U (en]) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212663U true JPH0212663U (en]) | 1990-01-26 |
Family
ID=31314129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8958488U Pending JPH0212663U (en]) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212663U (en]) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0367177A (ja) * | 1989-08-07 | 1991-03-22 | Nippondenso Co Ltd | 半導体加速度センサ |
| JP2004212246A (ja) * | 2003-01-06 | 2004-07-29 | Hitachi Metals Ltd | 加速度センサ |
| WO2007061050A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061059A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置およびその製造方法 |
| WO2007061056A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061047A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体およびその製造方法 |
| WO2007061054A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体、および同パッケージ構造体から得られるセンサ装置 |
-
1988
- 1988-07-06 JP JP8958488U patent/JPH0212663U/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0367177A (ja) * | 1989-08-07 | 1991-03-22 | Nippondenso Co Ltd | 半導体加速度センサ |
| JP2004212246A (ja) * | 2003-01-06 | 2004-07-29 | Hitachi Metals Ltd | 加速度センサ |
| WO2007061050A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061059A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置およびその製造方法 |
| WO2007061056A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | センサ装置及びその製造方法 |
| WO2007061047A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体およびその製造方法 |
| WO2007061054A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体、および同パッケージ構造体から得られるセンサ装置 |
| WO2007061062A1 (ja) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | ウェハレベルパッケージ構造体の製造方法 |
| US7674638B2 (en) | 2005-11-25 | 2010-03-09 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
| US8026594B2 (en) | 2005-11-25 | 2011-09-27 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
| US8067769B2 (en) | 2005-11-25 | 2011-11-29 | Panasonic Electric Works Co., Ltd. | Wafer level package structure, and sensor device obtained from the same package structure |
| US8080869B2 (en) | 2005-11-25 | 2011-12-20 | Panasonic Electric Works Co., Ltd. | Wafer level package structure and production method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0212663U (en]) | ||
| JPH0660906B2 (ja) | 半導体加速度センサ | |
| US5471876A (en) | Semiconductor accelerometer | |
| JPS6389282A (ja) | 触覚センサ | |
| JPH02102738U (en]) | ||
| JPS6144528U (ja) | はかり | |
| JPS6049438U (ja) | 半導体圧力センサ | |
| JPH032658U (en]) | ||
| JPH0271676U (en]) | ||
| JPH0170383U (en]) | ||
| JPH0569680U (ja) | 加速度センサ構造 | |
| JPS62190342U (en]) | ||
| JPH036527U (en]) | ||
| JPH0313753U (en]) | ||
| JPH01162255U (en]) | ||
| JPH0348242U (en]) | ||
| JPS58182135U (ja) | 拡散型半導体圧力センサ | |
| JPH03128952U (en]) | ||
| JPH04124462U (ja) | 加速度検出装置 | |
| JPH0229541U (en]) | ||
| JPH0241476U (en]) | ||
| JPS62190376U (en]) | ||
| JPS6437079U (en]) | ||
| JPS6338394U (en]) | ||
| JPS6045443U (ja) | リ−ドレスチツプキヤリアの搭載構造 |